Alleged Intel Sapphire Rapids Xeon Processor Image Leaks, Dual-Die Madness Showcased
These days, thanks to the ServeTheHome forum member “111alan”, we have the very first pictures of the alleged Intel Sapphire Rapids Xeon processor. Pictured is what seems to be a dual-die design comparable to Cascade Lake-SP design and style with 56 cores and 112 threads that takes advantage of two dies. The Sapphire Rapids is a 10 nm SuperFin design and style that allegedly will come even in the dual-die configuration. To host this processor, the motherboard requires an LGA4677 socket with 4677 pins existing. The new LGA socket, alongside with the new 10 nm Sapphire Rapids Xeon processors are set for shipping and delivery in 2021 when Intel is envisioned to start its new processors and their respective platforms.
The processor pictured is obviously a twin-die layout, which means that Intel applied some of its Multi-Chip Package deal (MCM) technology that uses EMIB to interconnect the silicon making use of an energetic interposer. As a reminder, the new ten nm Sapphire Rapids platform is intended to carry lots of new features like a DDR5 memory controller paired with Intel’s Knowledge Streaming Accelerator (DSA) a manufacturer new PCIe 5. conventional protocol with a 32 GT/s facts transfer level, and a CXL one.one support for upcoming-generation accelerators. The actual configuration of this processor is not known, on the other hand, it is an engineering sample with a clock frequency of a modest two. GHz.