AMD “Milan-X” Processor Could Use Stacked Dies with X3D Packaging Technology
AMD is in a constant system of processor advancement, and there are often new technologies on the horizon. Back in March of 2020, the company has uncovered that it is operating on new X3D packaging know-how, that built-in each two.5D and 3D strategies to packing semiconductor dies alongside one another as tightly as possible. Right now, we are ultimately obtaining some additional info about the X3D engineering, as we have the initially codename of the processor that is showcasing this sophisticated packaging technological innovation. According to David Schor, we have figured out that AMD is operating on a CPU that uses X3D tech with stacked dies, and it is termed Milan-X.
The Milan-X CPU is AMD’s future solution made for data heart usage. The rumors counsel that the CPU is made for large bandwidth and presumably a good deal of computing electric power. In accordance to ExecutableFix, the CPU takes advantage of a Genesis-IO die to electric power the connectivity, which is an IO die from EPYC Zen three processors. While this answer is in the works, we never know the specific launch date of the processor. Having said that, we could listen to much more about it in AMD’s digital keynote at Computex 2021. For now, just take this rumor with a grain of salt.