AMD to Implement TSMC SoIC Tech With Upcoming HPC Chips

AMD to Implement TSMC SoIC Tech With Upcoming HPC Chips

AMD will debut TSMC’s formidable Process-on-Built-in-Chips (SoIC) technological innovation with its forthcoming HPC chips, in accordance to a DigiTimes report. A phase toward rivaling Intel’s Foveros 3-D chip stacking know-how, SoIC will empower AMD to stack logic, memory, and I/O as different chips in a one offer. The article references a upcoming-technology “HPC” chip, whilst it did not delve into what this could be. Logically, AMD would want to integrate its EPYC and MI accelerator traces into a solitary bundle that can be used in HPCs. This kind of a product or service would combine its Zen-sequence x86-64 serial processing, with CDNA-collection scalar processing, abilities in memory, leveraging significant on-die victim-caches, and large-bandwidth memory (HBM) along with upcoming-gen I/O.

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