(PR) Intel Unveils New Tools in Its Advanced Chip Packaging Toolbox
What’s Fresh: This week at SEMICON West in San Francisco, Intel engineering leaders equipped an replace on Intel’s evolved packaging capabilities and unveiled fresh building blocks, including progressive uses of EMIB and Foveros together and a brand fresh Omni-Directional Interconnect (ODI) technology. When combined with Intel’s world-class route of applied sciences, fresh packaging capabilities will liberate customer enhancements and produce the computing systems of the next day.
“Our vision is to develop management technology to glue chips and chiplets in a kit to match the performance of a monolithic machine-on-chip. A heterogeneous come presents our chip architects unparalleled flexibility to mix and match IP blocks and route of applied sciences with a range of memory and I/O facets in fresh machine get dangle of factors. Intel’s vertically constructed-in construction offers an advantage within the period of heterogeneous integration, giving us an unmatched capability to co-optimize architecture, route of and packaging to bring management merchandise.” -Babak Sabi, Intel company vp, Meeting and Take a look at Technology Style.