X499 or X299G? Intel’s Fall 2019 HEDT Update Heralds a New Chipset?
Our readers noticed an spell binding visible part that missed us all thru our coverage of GIGABYTE’s three current socket LGA2066 motherboards unveiled at Computex 2019. One of many three boards, the X299S Designare 10G, has the laborious-marking “X499” on its CPU VRM heatsink. One other part that strikes us is that now now not one of many three current boards we pictured has “X299” printed on the PCB wherever. The Designare 10G has a sticky label under the broadcast GIGABYTE stamp that reads “X299G Designare 10G.” The purported X299G Aorus Grasp has one other attention-grabbing part: appropriate above the “Aorus Grasp” print, there may perhaps be a little sticky label marked “X299G,” positioned as if or now now not it’s holding up a published marking on the PCB itself.
All these miniature print lead us to surprise if GIGABYTE tried to quilt up that these boards are in level of truth primarily based mostly on the unannounced X499 Explicit chipset, and made to appear devour they’re X299. We simplest be pleased paper stickers and the gross sales insist placards that existing “X299,” whereas a steel embossing on the Designare 10G’s VRM heatsink reads X499. Intel in its Computex 2019 keynote launched that this is able to perhaps perhaps introduce current Core X HEDT processors. It be been over 2 years since the predominant Core X “Skylake-X” processors launched in Q2-2017. Intel refreshed the lineup in 2018 with 9th period branding and soldered TIM, with just a few specification improvements all the arrangement thru the product-stack, nonetheless a largely unchanged silicon. It be doubtless that the Tumble 2019 release may perhaps well perhaps stare current chips with increased core counts, presumably even the fabled 22-core die, and some hardware mitigation in opposition to fresh safety vulnerabilities.